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BALL PLACEMENT-2000


BALL PLACEMENT-2000
Flux ¹× ballÀÇ ÀÚµ¿ °ø±Þ
Fluxing toolÀÇ ÀÚµ¿ û¼Ò
½±°í ºü¸¥ ÄÁ¹öÀü: 5ºÐÀ̳»
ÀÚµ¿ Åø Á¤·Ä ¹× º¸Á¤ ±â´É (PRS)
³ôÀº »ý»ê¼º: 10 sec/stripÀÇ »çÀÌŬ ½Ã°£
SubstrateÀÇ ÈÚ º¸»ó ±â´É


Vision System 1st Vision Substrate Orientation, Package Type, Auto alignm
2nd Vision Flux Tool Inspection
3rd Vision Ball Tool Inspection
4th Vision Ball quality, Position, final Inspection
Flux Dotting Pin dotting
Ball Mounting Vacuum pick up & ejection type
Cycle Time 10 Sec/Strip
Applicable Range
- Solder Ball Size
- Solder Ball Pitch
- Substrate Dimension
Over 0.3 mm
Over 0.5 mm
35~100 x 160~250 mm(WxL)
Ball Mounting Accuracy ¡¾ 0.05 mm ( ¡¾ 2 mil)
Conversion Time below 5 Min
Machine Dimension 2,350 x 1,300 x 1,560 mm (LxWxH)
Machine Weight 1,800 kg
Air Supply Over 50 PSI
Power Supply 200~450VAC, 50/60Hz, 3 Phase
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