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CROPPED INGOT INSPECTION SYSTEM INGOT & GLASS BONDING SYSTEM WAFER SPLITTER
 
DEMOUNT &PRE-CLEANING SYSTEM FINAL-CLEANING SYSTEM
 
WAFER INSPECTION & SORTING SYSTEM AUTO PACKING SYSTEM

Auto Packing system
- Automatic packing system for Wafer
- Wrap Up the Wafer Units by Hot air
- Fully available to attach the Tape Labeling

* This product of HANMI Semiconductor is protected by the property right of industry.