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CROPPED INGOT INSPECTION SYSTEM INGOT & GLASS BONDING SYSTEM WAFER SPLITTER
 
DEMOUNT &PRE-CLEANING SYSTEM FINAL-CLEANING SYSTEM
 
WAFER INSPECTION & SORTING SYSTEM AUTO PACKING SYSTEM

Demount & Pre-Cleaning System
Characterized Bath Tank showing Perfect Cleaning Quality
- Bath Tank can be selective among 6 and 9ea
Reliable Diced Wafer Separation in the Wet Magazine
Fully available to integrate the Wafer Splitting System, Final Cleaning System
Small Foot print
Minimizing the DI Water Usage
- 61,868§¤/Day
Applicable Wafer
- Mono and multi crystal silicon wafer
- Thickness : 170 ~ 200 §­
- Dimension : 125 ~ 165 mm square
Detail Maintenance guide on LCD touch screen monitor

* This product of HANMI Semiconductor is protected by the property right of industry.