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CROPPED INGOT INSPECTION SYSTEM INGOT & GLASS BONDING SYSTEM WAFER SPLITTER
 
DEMOUNT &PRE-CLEANING SYSTEM FINAL-CLEANING SYSTEM
 
WAFER INSPECTION & SORTING SYSTEM AUTO PACKING SYSTEM

Ingot & Glass Bonding System
All-In-One system with conveyor feeding, cleaning, drying,
  dispensing (bonding) & pressing (attachment)
High productivity : 8 ingots / hour
Multiple ingot stock at inlet & outlet
Precise ingot & glass handling without any mis-feeding
  & damage
Machine flexibility to handle both ¨ª165 & ¨ª210 of ingot
Highly efficiency of cleaning & drying station
Station buffer & pressing tension control for optional
Stable Bonding and Handling technology using by Pallet Jig

* This product of HANMI Semiconductor is protected by the property right of industry.