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Products > Semiconductor
Equipment |
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 CSP PUNCH SINGULATION |
Punching type singulation
High throughput of UPH 42,000 (for 4x4 high density
lead frame)
Offloading to tray/tube
Advanced user interface with statistics process
control
Reject/rework unit sorting function.
Easy & Quick conversion. |
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| Vision System |
1st Vision |
package orientation, package type, turnover |
| 2nd Vision |
X-Y dimension, cutting quality, lead/Pad area |
| 3nd Vision |
marking quality, Reject marked unit check. |
| Dimension |
2,500x1,710x1,790 mm (WxLxH) |
| Weight |
2,300kg |
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| * This
product of HANMI Semiconductor is protected by the property
right of industry. |
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