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Products > Semiconductor
Equipment |
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 SAWING & PLACEMENT-3800L |
High productivity : 17,000 UPH
(unit/hour)
Live bug unit handling with flip-over function
(BGA : ball up cutting & ball down off-loading)
Smart & individual rotation of off-loading
picker with position compensation function
Easy & quick conversion : Max. 9 mintues
Installed high performance vision inspection system
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| for MLP, MLF, QFN, QLP, BCC, Mini BGA, LFBGA, SS-BGA, EBGA, CA-BGA, TBGA, FBGA, MW-BGA, UL-BGA, LGA.... |
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| Vision System |
1st Vision |
Orientation, package type, turnover inspection |
| 2nd Vision |
package outline dimension inspection , ball quality inspection, lead/Pad quality inspection |
| 3rd Vision |
X-mark inspection, Mark quality inspection |
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Vision 6-side inspection (optional item) |
| Dimension |
3,150x1,600x1800mm (L x W x H) |
| Power supply |
AC 220~480V, 3Phase, 50/60Hz |
| Air supply |
5 kgf/cm 2 |
| Water supply |
3 kgf/cm 2 |
| Substrate |
Width : 35~75mm
Length : 170~250mm |
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| * This
product of HANMI Semiconductor is protected by the property
right of industry. |
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