HANMI Semiconductor showcased its 2.5D package type ‘TC BONDER 2.0 CW (Thermo-Compressor Bonder Chip to Wafer’ equipment in the Taiwanese market which is an equipment applicable to the Taiwanese TSMC ‘CoWoS (Chip on Wafer on Substrate)’ package for the first time.

According to HANMI Semiconductor on the 6th, they have been participating as an official sponsor in the 2023 SEMICON Taiwan exhibition, which opened in Taiwan on the same day.

An official from HANMI Semiconductor said, “The TC BONDER CW equipment, which is introduced for the first time through this SEMICON Taiwan exhibition, is a 2.5D packaging bonder that attaches artificial intelligence GPUs and HBM semiconductors to silicon interposers.” And also, “It is applicable to CoWoS packaging, the next-generation technology of TSMC, which has recently been the center of attention as an artificial intelligence semiconductor.”

He added, “Based on the competitiveness and know-how of DUAL TC BONDER technology, an essential process equipment for HBM, we will actively promote TC BONDER CW equipment at SEMICON Taiwan exhibition with the world’s largest semiconductor foundry company, TSMC and global OSAT companies, ASE, Amkor and SPIL.”

HANMI Semiconductor has applied for a total of 106 patents for bonding equipment (including those scheduled to be applied). It has an advantage with advanced technology and durability related to semiconductor bonding equipment, and its strategy is to further strengthen its competitiveness by adding TC BONDER 2.0 CW equipment.

Meanwhile, SEMICON Taiwan, which is held at Nangang Exhibition Hall in Taiwan until this 8th, is a semiconductor-related exhibition organized by Semiconductor Equipment and Materials International (SEMI). This year, 950 companies, including Lam Research and DISCO, are participated in and the exhibition is held as the largest ever. HANMI Semiconductor has been participating as the official sponsor of the SEMICON Taiwan exhibition since 2015.