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The new growth power, 3D inspection equipment for Semiconductor packaging
2013-07-01 8679
 

3D VISION INSPECTION-3000


HANMI Semiconductor, The new growth power, 3D inspection equipment for Semiconductor packaging


http://www.etnews.com/news/device/device/2791312_1479.html <- Go into details


HANMI Semiconductor has been planning to release 3D VISION INSPECTION-3000 equipment.


As an inspection equipment for semiconductor packaging with 3D, this 3D VISION INSPECTION-3000 is featured prominently both in speed and accuracy and set to be released soon.


3D VISION INSPECTION-3000 has 90000 UPH, which is twice faster than other competitors in this field. Besides, it is ahead of all rivals more than 10% when it comes to the accuracy.


3D VISION INSPECTION-3000 is just about to be introduced at SEMICON TIWAN in coming September 2013, and it has made many companies in this field focus on us.