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  215 HANMI Semiconductor's highest dividend since its foundation..."Expanding sales of HBM equipment" 2023-11-13 871
  214 HANMI Semiconductor commercialized 'ABC, AUTO BLADE CHANGE' technology for the first time 2023-11-13 632
  213 HANMI Semiconductor receives KRW 60 Billion ‘DUAL TC BONDER for HBM’ \order from SK Hynix 2023-10-04 1193
  212 HANMI Semiconductor showcases ‘TC BONDER GRIFFIN’ for next generation HBM 2023-09-19 1120
  211 HANMI Semiconductor showcases ‘TC BONDER 2.0 CW’ in SEMICON Taiwan 2023-09-06 1123
  210 HANMI Semiconductor launched ‘DUAL TC BONDER 1.0 DRAGON’ for HBM 2023-08-24 850
  209 HANMI Semiconductor’s Bonder Factory opens 2023-08-03 785
  208 HANMI Semiconductor showcases ‘Wafer micro SAW W’ at Semicon China 2023-06-29 871
  207 HANMI Semiconductor develops next-generation HBM process equipment…‘New Dual TC Bonder’ is about to be released 2023-06-26 1206
  206 HANMI Semiconductor, officially opened ‘HANMI Vietnam’ 2023-06-07 883